SMT – Adaptation to complex Structures and Substrate Topography
The extended design options of the M-TeCK stencil allow for the printing of closed frames and other complex structures. For example, printing of a closed solder paste frame ensures optimal wetting of HF shielding frames.
Solder paste frames with 250 µm line width and 110 µm height
In addition, the elastic characteristics of the M-TeCK still allow for the printing of substrates with significant surface waviness, which cannot be printed with a conventional stainless steel stencil.
